undefined
Super-Depth-of-Field 3D Microscope
Super-Depth-of-Field 3D Microscope
Product Overview
Technical Specifications
Product Advantages
Product Applications
Product Overview
- 3D Super-Depth-of-Field Digital Microscope System Yes Integrated digital microscopy imaging and measurement platform, supporting from 2D To 3D Observation and precision measurement, geared toward scientific research, materials science, and semiconductors, 3C Professional applications in electronics, metallography, life sciences, and other fields.
Technical Specifications
Category | Specifications
|
Imaging unit / Camera | 4K / High-Resolution CMOS (e.g., 30 fps at 4000×3000; 60 fps at 2560×1920; 12 MP, etc.) |
Objective Lens / Magnification | APO telecentric objectives and metallurgical objectives; supported across a range of zoom and fixed-magnification lenses from 20× to 7,500× (e.g., DMS-PA20, PA100, PA200, PA500, PA2500). |
Field of View (FOV) / Working Distance (WD) | Lens example: 20× FOV ≈ 19 mm, WD ≈ 18 mm; 2500× FOV ≈ 0.152 mm, WD ≈ 1.5 mm (refer to the selection table for specific values). |
Stage Travel Option | 60 × 50 mm; 120 × 100 mm; 330 × 330 mm; 100 × 100 mm |
Mobile resolution | Minimum achievable particle size: 0.04 μm (depending on configuration); common options: 0.1 μm, 1 μm. |
Maximum stage speed | Approximately 20–40 mm/s (depending on the model) |
Lighting method | Annular illumination; coaxial illumination; coaxial oblique illumination; mixed illumination; transmitted illumination; DIC; polarized light; dark-field; (some models support elimination of annular reflections) |
Software Features | Real-time depth-of-field fusion; HDR; image stitching (ultra-high-pixel stitching); navigation mapping; 2D/3D/profile/batch measurement; particle counting; roughness analysis; report export (CSV/Excel); one-click white balance; automatic calibration |
Hardware Platform | All-in-one PC (example: 28-inch 4K display; high-performance CPU; 64 GB RAM; SSD + HDD) |
Measurement and Analysis Capabilities | 2D/3D measurement; contour/height measurement; cross-field-of-view rapid measurement; batch 3D measurement; particle counting; roughness and cleanliness analysis; automatic edge/grayscale recognition |
Connectivity / Data Export | Export formats: CSV, Excel; custom reports can be generated (depending on software functionality). |
Environment / Power Supply (Typical) | For detailed information on power supply requirements, operating temperature and humidity ranges, and certifications, please refer to the model data sheet. |
Optional Modules / Accessories | Backup/Extended Camera; Polarizer; DIC Adapter; Transmitted/Reflected Light Kit; Dark-Field Adapter; Motorized Zoom; Dedicated Fixtures |
Product Advantages
- Super-Depth-of-Field Imaging: Autonomous Telecentricity APO An optical–real-time depth-of-field fusion algorithm that significantly enhances depth of field while preserving high-resolution details, making it ideal for observing uneven surfaces.
- High resolution and large magnification coverage: Supported 20X–7500X (Through different lenses / unit), balancing macro- and micro-level observations.
- Real-time Depth-of-Field Fusion and Ring Halo Removal: Optics + Algorithm for removing reflections, HDR and real-time continuous autofocus, enhancing image contrast and detail reproduction.
- Integrated intelligent operation: electric magnification switching, auto focus, XY/Z Electric stage and joystick controller enable fast, repeatable positioning and data acquisition.
- Powerful Measurement and Analysis: 2D/3D Measurement, contour / Height measurement, cross-field rapid measurement, batch 3D Measurement, particle counting, roughness and cleanliness analysis, automatic edge detection / Grayscale recognition reduces human error, and data can be exported. Excel/CSV And generate custom reports.
- Wide-field mosaicking and navigation: high-pixel image mosaicking (capable of ultra-high-resolution mosaicking), navigation map localization, 3D Mosaic stitching and deep synthesis are suitable for large-area sample inspection.
- Modularity and scalability: a variety of cameras, lenses, and observation adapters (polarization, DIC , Transmission / including reflection, dark-field, and other modes, as well as customizable platforms to meet diverse application requirements.
- Automation and Reproducibility: One-click calibration, reproducible imaging conditions, and automated measurement capabilities enhance inspection efficiency and consistency.
Product Applications
- Semiconductors and Electronics: Solder Joints / Pin height measurement, BGA Slicing, gold wire bonding, chip defect inspection, soldering / Coating Analysis
- Materials and Metallography: Metallographic Microstructure Observation, Fracture Surface Analysis, Roughness Measurement, and Surface Composition and Structure Analysis
- Batteries and Energy: Detection of Lithium-Ion Battery Electrode Slitting Burrs and Surface Defects
- Life / Biological samples: insect wings, compound eye structures, and hairs / Surface observation of the sample (requires selection based on sample type) / Reflection and Adapter Lens)
- Industrial Inspection: Cutting Tools / Blade damage, razor blades, powder / Particle counting and size distribution analysis, surface cleanliness assessment
- Large-size samples and mosaicking scenarios: require high-resolution, large-area mosaicking, navigation, and 3D Inspection task for splicing
Previous page:
Next page:
Submit your request
Contact us today for a free expert consultation!
Related Products
As a high-tech company "driven by technology and anchored in service," we have placed great emphasis on our technical expertise and R&D capabilities since our inception.
Shining Scientific Technology(China) Co.,Ltd.
Submit your request
Contact us today for a free expert consultation!