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Product Overview
Technical Specifications
Product Advantages
Product Applications
Product Overview
- The 3D ultra-depth-of-field digital microscope system is an integrated digital imaging and measurement platform that supports observation and precision measurement from 2D to 3D. It is designed for professional applications such as research, materials, semiconductors, 3C electronics, metallography, and life sciences.
Technical Specifications
Category | Specification |
Imaging unit / Camera | 4K / high-resolution CMOS (e.g., 30 fps @ 4000×3000; 60 fps @ 2560×1920; 12 MP and other configs) |
Objectives / Magnification | APO telecentric & metallographic objectives; support 20X–7500X via various zoom/fixed lenses (e.g., DMS-PA20 / PA100 / PA200 / PA500 / PA2500) |
Field of View (FOV) / Working Distance (WD) | Examples by lens: 20X FOV ≈ 19 mm, WD ≈ 18 mm; 2500X FOV ≈ 0.152 mm, WD ≈ 1.5 mm (refer to model selection for exact values) |
Stage Travel Options | 60 × 50 mm; 120 × 100 mm; 330 × 330 mm; 100 × 100 mm |
Stage Resolution | Down to 0.04 μm (varies by configuration); common options: 0.1 μm, 1 μm |
Maximum Stage Speed | Approximately 20–40 mm/s (model dependent) |
Illumination Modes | Ring illumination; coaxial illumination; coaxial oblique; mixed illumination; transmission; DIC; polarization; darkfield; ring-glare reduction (some models) |
Software Features | Real-time depth fusion; HDR; image stitching (ultra-large mosaics); navigation maps; 2D/3D/profile/batch measurement; particle counting; roughness analysis; report export (CSV/Excel); one-click white balance; auto-calibration |
Hardware Platform | All-in-one PC (example: 28" 4K display; high-performance CPU; 64 GB RAM; SSD + HDD) |
Measurement & Analysis Capabilities | 2D/3D measurement; profile/height measurement; cross-field rapid measurement; batch 3D measurement; particle counting; roughness & cleanliness analysis; automatic edge/grayscale recognition |
Connectivity / Data Export | Export formats: CSV, Excel; customizable report generation (software dependent) |
Environmental / Power (typical) | Refer to datasheet for model-specific power supply, operating temp/humidity and certifications |
Optional Modules / Accessories | Additional cameras; polarizers; DIC adapters; transmission/reflection kits; darkfield adapters; motorized zoom; specialized fixtures |
Product Advantages
- Ultra-depth-of-field imaging: Proprietary telecentric APO optics combined with real-time depth-fusion algorithms significantly increase depth of field while preserving high-resolution detail—ideal for observing uneven surfaces.
- High resolution and wide magnification coverage: Supports 20X–7500X (via different lenses/optical units), covering both macro- and micro-observation needs.
- Real-time depth fusion and halo removal: Optical and algorithmic methods remove glare/halo effects, provide HDR and continuous-focus imaging, and improve image contrast and detail.
- Integrated intelligent operation: Motorized magnification switching, auto-focus, motorized X/Y/Z stage, and handheld controller enable fast, repeatable positioning and capture.
- Powerful measurement and analysis: 2D/3D measurement, profile/height measurement, cross-field rapid measurement, batch 3D measurement, particle counting, roughness and cleanliness analysis. Automatic edge/grayscale recognition reduces operator error; data can be exported to Excel/CSV and custom reports can be generated.
- Large-field stitching and navigation: High-resolution image stitching (up to ultra-large mosaics), navigation maps, 3D stitching and depth composition—suitable for large-area sample inspection.
- Modular and extensible: Multiple cameras, lenses, and observation adapters (polarization, DIC, transmission/reflection, darkfield, etc.) and customizable platforms to meet different application needs.
- Automation and reproducibility: One-click calibration, reproducible capture conditions, and automated measurement functions improve inspection efficiency and consistency.
Product Applications
- Semiconductor & Electronics: Solder Joint/Pin Height Measurement, BGA Sectioning, Gold Wire Bonding, Chip Defect Detection, Solder/Plating Analysis
- Materials & Metallography: Metallographic Structure Observation, Metal Cross-Section, Roughness, Composition and Surface Structure Analysis
- Battery & Energy: Lithium Battery Electrode Burr Detection, Electrode Surface Defect Detection
- Life/Biological Samples: Insect Wings, Compound Eye Structure, Hair/Tissue Surface Observation (Transmission/Reflection mode and suitable lens should be selected according to sample type)
- Industrial Detection: Tool/Edge Damage, Razor Blades, Powder/Particle Counting and Size Statistics, Surface Cleanliness Analysis
- Large-Size Samples & Stitching Scenarios: Inspection tasks requiring high-resolution large-range stitching, navigation and 3D stitching
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As a high-tech company "driven by technology and anchored in service," we have placed great emphasis on our technical expertise and R&D capabilities since our inception.
Shining Scientific Technology(China) Co.,Ltd.
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