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Ultra-depth 3D Digital Microscope
Ultra-depth 3D Digital Microscope
Product Overview
Technical Specifications
Product Advantages
Product Applications
Product Overview
The SHINING SCIENTIFIC DMS Series 3D Digital Microscope is an advanced ultra-depth-of-field imaging and measurement system designed for high-precision industrial inspection, semiconductor analysis, materials research, and scientific imaging applications.
Integrating high-resolution optical imaging, intelligent autofocus, 3D measurement, real-time depth fusion, and automated image analysis, the DMS Series provides a complete all-in-one digital microscopy solution for modern laboratories and industrial environments.
The system supports ultra-wide magnification ranges, intelligent motorized control, high-speed image stitching, and advanced AI-assisted measurement technologies, enabling users to achieve fast, accurate, and repeatable microscopic analysis with exceptional clarity and efficiency.
Technical Specifications
| Item | DMS Series |
|---|---|
| Product Type | 3D Digital Microscope |
| Magnification Range | 20X – 7500X |
| Camera | 12MP High-Resolution Camera |
| Resolution | Up to 4000 × 3000 |
| Display | 28-inch 4K UHD Display |
| Optical System | Telecentric Continuous Zoom |
| Observation Modes | Brightfield / Darkfield / Polarized / DIC |
| Illumination | Ring / Coaxial / Transmitted / Hybrid |
| Stage Type | Motorized XY Stage |
| Stage Travel | Up to 330 × 330 mm |
| Tilt Angle | ±90° |
| Image Stitching | 2D & 3D |
| Measurement Functions | 2D / 3D / Contour / Area / Volume |
| Image Processing | HDR / Focus Stacking / Glare Removal |
| Data Export | Word / Excel / CSV |
| Computer System | Intel i7 / 64GB RAM / SSD + HDD |
| Power Supply | 100–240V AC 50/60Hz |
Product Advantages
1. Ultra-Depth 3D Imaging Technology
Advanced real-time depth fusion technology generates fully focused high-resolution images, even on uneven sample surfaces, delivering exceptional 3D visualization and analysis capability.
2. Intelligent Motorized Control System
Integrated motorized XY stage, autofocus system, and electric objective switching allow intuitive and efficient operation through the dedicated controller.
3. Wide Magnification Range
Supports rapid one-touch magnification switching from 20X up to 7500X, meeting diverse observation and measurement requirements.
4. High-Precision Measurement & Analysis
Provides comprehensive 2D and 3D measurement tools including contour measurement, particle analysis, area calculation, height measurement, and automated edge recognition.
5. Advanced Optical System
Equipped with professional telecentric APO objective lenses for ultra-high-resolution imaging with minimal distortion and exceptional detail reproduction.
6. Powerful Image Processing
Features HDR imaging, anti-reflection processing, real-time focus stacking, glare removal, and large-area image stitching for superior image quality.
Product Applications
Semiconductor Inspection
High-precision imaging and measurement for IC packaging, PCB inspection, solder analysis, and semiconductor defect detection.
Materials Science
Suitable for surface morphology analysis, metallography, roughness measurement, and advanced material characterization.
Industrial Quality Control
Used for precision component inspection, dimensional analysis, and failure analysis in manufacturing environments.
Biological & Scientific Research
Applicable for biological samples, insects, algae, fibers, and scientific imaging applications.
Forensic & Document Analysis
Supports handwriting indentation analysis, surface trace detection, and forensic imaging applications.
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As a high-tech company "driven by technology and anchored in service," we have placed great emphasis on our technical expertise and R&D capabilities since our inception.
Shining Scientific Technology(China) Co.,Ltd.
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Contact us today for a free expert consultation!