SC-FS200 Floor-standing W-SEM

SC-FS200: A compact SEM featuring an oversized chamber and 300,000× magnification, delivering a flagship imaging experience

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Product Overview

Technical Specifications

Product Advantages

Product Applications

Product Overview

The SC-FS200 is a compact SEM with full-size performance. Supplied with a tungsten filament source, its magnification can reach 300,000x, ideal for imaging larger samples due to its oversize chamber, theThe SC-FS200 comes with an impressive set of features typically seen on more expensive microscopes, including both a Navigation Camera and a Chamber Camera for increased versatility.
• Magnification 30× to 300,000×
• Motorized 5-axis (X, Y, Z, R, T) stage
• Navigation Cam, Chamber Cam
• Easy to take large samples

Technical Specifications

Spec Item
Dimension	680 × 780 × 1460 mm (W × L × H)
Electron source	Tungsten filament
Resolution	3.0 nm
Magnification	30× ~ 300,000×
Gun vacuum	10⁻⁶ torr
Accelerating voltage	1 ~ 30 kV
Motorized stage travel	Chamber type (X,Y,Z,R,T) = 50, 50, 45 mm; 360°, -20° ~ 45°
Vacuum system	Rotary pump + TMP

Product Advantages

Dual-Camera Visual Navigation Equipped with both an optical navigation camera and a chamber view camera. This system supports intuitive "click-to-move" positioning and real-time monitoring of the interior, ensuring safe operation and preventing collisions.

5-Axis Motorized Stage Features full motorized control over X, Y, Z, Rotation (360°), and Tilt (-20° to 45°). This allows for comprehensive, multi-angle observation of complex samples without manual adjustment.

High Performance & Resolution Despite its compact footprint, the system delivers full-scale SEM performance with 3.0 nm resolution. It supports a wide acceleration voltage range (1–30 kV) and effective magnification up to 300,000x, capturing nano-scale details with clarity.

Large Sample Chamber The optimized chamber design accommodates larger samples, allowing for non-destructive analysis and reducing the need for sample cutting or complex pre-processing.

Product Applications

Materials Science: Metal fracture analysis, nanomaterial morphology, and powder/ceramic grain size observation.

Semiconductors & Electronics: PCB/PCBA solder joint inspection, wire bonding analysis, and packaging defect detection.

Quality Control: Surface defect troubleshooting, contaminant/particle analysis, and coating quality monitoring.

Life Science: Observation of biological tissue surfaces, pollen, and seed morphology.

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